Description
If you need a high grab contact adhesive for large surface bonding, Evo-Stik Bostik 613 is a proven industrial solution designed for laminate, board and panel applications.
This solvent-based contact adhesive delivers strong initial grab and high shear strength, making it ideal for bonding materials to vertical and horizontal surfaces such as walls, ceilings and panel systems.
Unlike thicker gel adhesives, this standard (non-thixotropic) formulation flows easily, allowing smooth, even coverage across large areas using a brush or spreader — perfect for fabrication, fit-out and workshop use.
🔧 Key Benefits
- High grab contact adhesive – Strong initial bond for fast assembly
- Designed for laminates & panels – Ideal for MDF, chipboard and decorative surfaces
- Excellent coverage – Perfect for large surface applications
- High shear strength – Reliable long-term performance
- Good temperature resistance – Suitable for interior environments
- Easy application – Brush or spreader for controlled coverage
⚙️ Typical Applications
- Bonding laminate to MDF, chipboard or plywood
- Fixing decorative panels and wall boards
- Bonding plastic laminates and rigid plastics
- Interior fit-out and joinery work
- Vehicle and marine interior panels
- Upholstery, trim and fabrication work
🧱 Suitable Materials
- Laminates and decorative panels
- MDF, chipboard, plywood and board materials
- Rubber sheeting and supported PVC
- Leather and synthetic materials
- GRP / fibreglass
- Painted and unpainted metal
⚠️ Important Limitations
- Not suitable for polyethylene (PE), polypropylene (PP) or PTFE
- Intended for interior use only
- Not suitable where only point contact is achieved
🧠 When to Use Evo-Stik 613
Evo-Stik Bostik 613 is the ideal choice when you need:
- A high grab contact adhesive for laminate or panels
- Strong bonding across large surface areas
- A reliable adhesive for interior construction and fabrication
- Smooth application across flat or vertical surfaces
👉 For best results, apply to both surfaces, allow to dry, then bond under firm pressure.
